ㆍ Adhesive strength

    - Provides excellent adhesion to PCB and component materials.

ㆍ Hardness

    - Over Shore D 80.

ㆍ Minimize appearance change due to low heat during curing

    - The adherend is safe due to low heat generation during curing.

    - Compared to general epoxy molding products, yellowing is minimized.

ㆍ Realization of stable fast curing

    - Regardless of the capacity, it is possible to secure the shape after 30 to 40 minutes at

      room temperature.

ㆍ Heat resistance

    - Stable adhesion is realized within the range of 150℃.

ㆍ Environmental condition

    - Free of 6 heavy metals (Cd/Pb/Hg/Cr 6+/PBBs/PBDEs).

    - Halogen (Cl, Br, F, I) less than 900ppm, suitable for electronic materials.

    - Solvent-free

ㆍ Provides user-customized workability

    - Designed with optimized viscosity for efficient molding.

    - Air bubbles are minimized at room temperature.